Methods for fabricating redeposition free thin film CPP read...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S603140, C029S846000, C204S192100, C204S192170, C427S451000

Reexamination Certificate

active

07111382

ABSTRACT:
Methods are provided for forming current perpendicular to the plane thin film read heads. In one embodiment, the method comprises the steps of forming a lower sensor lead, forming a lower sensor lead cladding of a low sputter yield material on the lower sensor lead, forming a sensor element on the lower sensor lead cladding, and forming an upper sensor lead coupled to the sensor element. The low sputter yield material helps to reduce redeposition of the lower sensor lead material onto side walls of the sensor element as the sensor element is being formed.

REFERENCES:
patent: 3666665 (1972-05-01), Chapman et al.
patent: 4230750 (1980-10-01), Yurasko, Jr.
patent: 4914538 (1990-04-01), Howard et al.
patent: 5268806 (1993-12-01), Goubau et al.
patent: 5491600 (1996-02-01), Chen et al.
patent: 5668688 (1997-09-01), Dykes et al.
patent: 5680282 (1997-10-01), Alhert et al.
patent: 5828532 (1998-10-01), Ahlert et al.
patent: 5883764 (1999-03-01), Pinarbasi
patent: 5901018 (1999-05-01), Fontana, Jr. et al.
patent: 5920980 (1999-07-01), Han et al.
patent: 5946167 (1999-08-01), Hara et al.
patent: 5959811 (1999-09-01), Richardson
patent: 6002553 (1999-12-01), Stearns et al.
patent: 6023395 (2000-02-01), Dill et al.
patent: 6114719 (2000-09-01), Dill et al.
patent: 6118638 (2000-09-01), Knapp et al.
patent: 6134089 (2000-10-01), Barr et al.
patent: 6249407 (2001-06-01), Aoshima et al.
patent: 6433970 (2002-08-01), Knapp et al.
patent: 61084572 (1986-04-01), None
patent: 63-95983 (1988-04-01), None
patent: 6-53649 (1994-02-01), None
patent: 07073418 (1995-03-01), None
patent: 10208217 (1998-08-01), None
patent: 11039611 (1999-02-01), None
U.S. Appl. No. 10/176,874, Knapp, Structure and Method for Redeposition Free Thin Film CPP Read Sensor Fabrication, filed Jun. 21, 2002.
Lee, Robert E., “Microfabrication by Ion-Beam Etching,” J. Vac. Sci. Technol., 16(2), Mar./Apr. 1979, pp. 164-170.
Melliar-Smith, C.M., “Ion Etching for Pattern Delineation,” J. Vac. Sci. Technol., 13(5), Sep./Oct. 1976, 1008-22.
Cantagrel, Michel, “Considerations on High Resolution Patterns Engraved by Ion Etching,” IEEE Transactions on Electron Devices, vol. ED-22, No. 7, Jul. 1995, pp. 483-486.

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