Methods for fabricating multi-terminal phase change devices

Details Methods for fabricating multi-terminal phase change devices Methods for fabricating multi-terminal phase change devices

2005-11-03

2009-02-24

Menz, Douglas M (Department: 2891)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

With electrical circuit layout

C438S102000, C257S004000, C257SE21645, C257SE31029

Reexamination Certificate

active

07494849

ABSTRACT:
Phase change devices, and particularly multi-terminal phase change devices, include first and second active terminals bridged together by a phase-change material whose conductivity can be modified in accordance with a control signal applied to a control electrode. This structure allows an application in which an electrical connection can be created between the two active terminals, with the control of the connection being effected using a separate terminal or terminals. Accordingly, the resistance of the heater element can be increased independently from the resistance of the path between the two active terminals. This allows the use of smaller heater elements thus requiring less current to create the same amount of Joule heating per unit area. The resistance of the heating element does not impact the total resistance of the phase change device. The programming control can be placed outside of the main signal path through the phase change device, reducing the impact of the associated capacitance and resistance of the device.

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