Methods for fabricating microelectronic structures including sem

Details Methods for fabricating microelectronic structures including sem Methods for fabricating microelectronic structures including sem

1996-08-16

1999-05-25

Dutton, Brian

Semiconductor device manufacturing: process

Having diamond semiconductor component

29 2535, H04R 1700

Patent

active

059077689

ABSTRACT:
A method for fabricating a microelectronic structure includes the steps of forming a semiconductor island on a substrate and forming a filler material on the substrate and surrounding the semiconductor island. The semiconductor island includes a first semiconductor material and has a planar island surface opposite the substrate. The filler material includes a second semiconductor material and has a planar single crystal surface adjacent the planar island surface opposite the substrate so that the planar island surface and the planar single crystal surface together define a smooth planar surface. The first semiconductor material can be diamond, and the second semiconductor material can be silicon. In addition, a microelectronic circuit can be formed on the filler material.

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