Methods for epitaxial silicon growth

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C117S094000, C117S095000, C117S096000, C117S929000

Reexamination Certificate

active

07101435

ABSTRACT:
Methods of cleaning substrates and growing epitaxial silicon thereon are provided. Wafers are exposed to a plasma for a sufficient time prior to epitaxial silicon growth, in order to clean the wafers. The methods exhibit enhanced selectivity and reduced lateral growth of epitaxial silicon. The wafers may have dielectric areas that are passivated by the exposure of the wafer to a plasma.

REFERENCES:
patent: 4624736 (1986-11-01), Gee et al.
patent: 5304405 (1994-04-01), Kobayashi et al.
patent: 5373806 (1994-12-01), Logar
patent: 5403434 (1995-04-01), Moslehi
patent: 5968279 (1999-10-01), MacLeish et al.
patent: 6362510 (2002-03-01), Gardner et al.
patent: 6391788 (2002-05-01), Khan et al.
patent: 2001/0015438 (2001-08-01), Callegari et al.
patent: 2002/0098627 (2002-07-01), Pomarede et al.
patent: 2003/0141499 (2003-07-01), Venkatraman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods for epitaxial silicon growth does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for epitaxial silicon growth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for epitaxial silicon growth will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3531847

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.