Methods for enhancing within-wafer CMP uniformity

Details Methods for enhancing within-wafer CMP uniformity Methods for enhancing within-wafer CMP uniformity

2005-08-16

2005-08-16

Thomas, David B. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S060000, C451S057000, C451S446000

Reexamination Certificate

active

06929533

ABSTRACT:
A method for enhancing uniformity in the polishing profile of a substrate during chemical mechanical polishing. According to a first embodiment, the method is adapted for a rotary-type chemical mechanical polisher and includes dispensing the polishing slurry onto the rotating polishing pad of the CMP apparatus in a polishing area on the polishing pad that contacts the entire surface area of the substrate. This facilitates substantially equal polishing rates and a substantially uniform polishing profile from the center to the edge regions on the surface of the substrate. According to a second embodiment, the method of the present invention is adapted for a linear-type chemical mechanical polisher and includes increasing the number of nozzles that dispense the slurry onto the polishing pad across the diameter or width of the substrate.

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