Methods for enhancing fracture conductivity in subterranean...

Wells – Processes – Specific propping feature

Reexamination Certificate

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C166S295000, C166S276000, C166S281000

Reexamination Certificate

active

08082994

ABSTRACT:
Methods of enhancing the conductivity of fractures in subterranean formations comprising: providing a propped fracture in a subterranean formation wherein a plurality of proppant particulates reside in at least a portion of the fracture; providing a displacement fluid; introducing the displacement fluid into the propped fracture in the subterranean formation at a rate that is at least the matrix rate of the subterranean formation; and allowing the displacement fluid to displace at least a portion of the plurality of proppant particulates, thereby forming at least one channel in the propped fracture.

REFERENCES:
patent: 3349851 (1967-10-01), Huitt et al.
patent: 3757864 (1973-09-01), Crawford et al.
patent: 3815680 (1974-06-01), McGuire et al.
patent: 4078609 (1978-03-01), Pavlich
patent: 4527627 (1985-07-01), Graham et al.
patent: 4982793 (1991-01-01), Holtmyer et al.
patent: 5067565 (1991-11-01), Holtmyer et al.
patent: 5122549 (1992-06-01), Holtmyer et al.
patent: 5799734 (1998-09-01), Norman et al.
patent: 5833000 (1998-11-01), Weaver et al.
patent: 5839510 (1998-11-01), Weaver et al.
patent: 5846915 (1998-12-01), Smith et al.
patent: 5853048 (1998-12-01), Weaver et al.
patent: 5960880 (1999-10-01), Nguyen et al.
patent: 6439309 (2002-08-01), Matherly et al.
patent: 7213651 (2007-05-01), Brannon et al.
patent: 2005/0211439 (2005-09-01), Willett et al.
patent: 2005/0274517 (2005-12-01), Blauch et al.
patent: 2005/0277554 (2005-12-01), Blauch et al.
patent: 2009/0044945 (2009-02-01), Willberg et al.

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