Methods for encapsulating electronic devices

Fishing – trapping – and vermin destroying

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437210, 437211, 437219, 148DIG17, 134 1, H01L 2160

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active

053489136

ABSTRACT:
In a preferred embodiment of the invention, a substrate (11) is cleaned by immersing it in an organic solvent (17) and subjecting it to acoustic energy, immersing it in alcohol, immersing it in a surfactant, subjecting it to a cascading rinse in deionized water, baking it (FIG. 3 ), and thereafter subjecting it to ultraviolet light in an ozone ambient (FIG. 4). When the foregoing steps are followed, the contact angle is significantly reduced, and an encapsulant (14) that is thereafter applied provides more reliable protection to an encapsulated device (12) from outside contaminants.

REFERENCES:
patent: 4983548 (1991-01-01), Uno et al.
patent: 4984597 (1991-01-01), McConnell et al.
patent: 5028560 (1991-07-01), Tsukamoto et al.
patent: 5151135 (1992-09-01), Magee et al.
patent: 5158616 (1992-10-01), Kinoshita et al.
patent: 5203798 (1993-04-01), Watanabe et al.
patent: 5240018 (1993-08-01), Clark et al.
"Electrical Performance and Reaction Kinetics of Silicone Gels," C. P. Wong, Journal of Material Research, vol. 5, No. 4, Apr. 1990, pp. 795-800.
"Understanding the Use of Silicone Gels for Non-Hermetic Plastic Packaging," C. P. Wong et al., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 2, No. 4, Dec. 1989, pp. 421-425.

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