Methods for dynamically controlling a semiconductor dicing saw

Details Methods for dynamically controlling a semiconductor dicing saw Methods for dynamically controlling a semiconductor dicing saw

2005-09-20

2005-09-20

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S009000, C451S010000, C451S041000, C125S012000, C125S013010

Reexamination Certificate

active

06945844

ABSTRACT:
A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion of a wafer. Thus, irregular shaped wafers may be cut without requiring that an entire predefined cutting pattern be carried out and/or without previously mapping the shape of the wafer or portion of a wafer. A map of the wafer or a portion of a wafer may also be generated based on the detection of the saw blade contacting the wafer during a first cutting pass and may be used during a second cutting pass.

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