Methods for dicing a released CMOS-MEMS multi-project wafer

Details Methods for dicing a released CMOS-MEMS multi-project wafer Methods for dicing a released CMOS-MEMS multi-project wafer

2005-11-10

2008-10-14

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S464000, C438S792000, C257SE21255, C257SE21256

Reexamination Certificate

active

07435663

ABSTRACT:
Simple but practical methods to dice a CMOS-MEMS multi-project wafer are proposed. On this wafer, micromachined microstructures have been fabricated and released. In a method, a photoresist is spun on the full wafer surface, and this photoresist is thick enough to cover all cavities and structures on the wafer, such that the photoresist will protect the released structures free from the chipping, vibrations, and damages in the diamond blade dicing process. In another method, a laser dicing system is utilized to scribe the multi-project wafer placed on a platform, and by precisely controlling the platform moving-track, the dicing path can be programmed to any required shape and region, even it is not straight. In addition, the wafer backside is mounted on a blue-tape at the beginning to enhance the process reliability.

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