Methods for determining bond failure modes using stress wave emi

Details Methods for determining bond failure modes using stress wave emi Methods for determining bond failure modes using stress wave emi

1979-04-12

1980-11-11

Ciarlante, Anthony V.

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

G01N 2900

Patent

active

042325587

ABSTRACT:
As leads that have been thermocompressively bonded to ceramic substrates are pulled to destruction, stress waves are monitored and counted. The total count is compared to empirically developed ranges associated with known failures to determine the failure mode (e.g., lead failure, gold-to-gold failure, ceramic pullout).

REFERENCES:
patent: 3924456 (1975-12-01), Vahaviolos
patent: 3969927 (1976-07-01), Yoshida et al.
patent: 4004456 (1977-01-01), Vahaviolos
patent: 4090400 (1978-05-01), Vahaviolos
G. G. Harman, "The Use of Acoustic Emission in a Test for Beam Lead Bond Integrity", NBS, 14th Annual Proceedings IEEE Reliability Physics, Apr. 20-22, 1976.

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