Methods for creating ground paths for ILS

Details Methods for creating ground paths for ILS Methods for creating ground paths for ILS

2008-01-22

2008-01-22

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603150, C029S603160, C029S831000, C029S842000, C029S860000, C029S885000, C360S122000, C360S125330, C360S317000, C216S065000, C427S127000, C427S128000

Reexamination Certificate

active

07320174

ABSTRACT:
Methods for creating a ground path between a stainless steel suspension and a copper trace layer in an integrated lead assembly of a disk drive suspension. The invention prevents electrostatic discharge (ESD) damage by providing a means for grounding a lead to a controlled ground potential. Although the lead and suspension are generally separated by an insulating layer such as a polymide layer, connection between the lead and suspension can be made by, for example, creating an opening in the insulation layer and depositing a conductive material such an electrically conductive glue, solder or some other material through the opening to connect the two electrically conductive layers. A rivet may also be used to connect the two electrically conductive layers through a through hole that extends through both electrically conductive layers and the electrically insulating layer.

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“Effect of air-bearing design on slider dynamics during unloading process”; Tanaka, H.; Kohira, H.; Matsumoto, M.; Magnetics, IEEE Transactions on vol. 37; Jul. 2001; pp. 1818-1820.

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