Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-10-03
2006-10-03
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S041000, C451S287000
Reexamination Certificate
active
07115017
ABSTRACT:
Methods are provided for controlling adjustable pressure zones of a CMP carrier. A method comprises determining a first thickness of a layer on a wafer underlying a first zone of the carrier. A first portion of the layer underlying the first zone is removed. The first zone is configured to exert a first pressure against the second surface of the wafer. A second thickness of the layer underlying the first zone is determined and a target thickness corresponding to a predetermined thickness profile is selected. A second pressure for the first zone is calculated using the first thickness, the second thickness, the first pressure, and the target thickness. The pressure exerted by the first zone against the second surface of the wafer is adjusted to the second pressure and the steps are repeated for a second zone.
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Franzen Paul
Laursen Thomas
Quarantello Justin
Stotts Thomas
Ingrassia Fisher & Lorenz P.C.
Novellus Systems Inc.
Ojini Anthony
Wilson Lee D.
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