Methods for controlling semiconductor workpiece surface exposure

Semiconductor device manufacturing: process – Chemical etching

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438745, 216 90, H01L 21302

Patent

active

060907118

ABSTRACT:
The present invention provides semiconductor workpiece processors and methods of wetting and processing a semiconductor workpiece. One method of wetting and processing a semiconductor workpiece with process fluid comprises providing a semiconductor workpiece having a surface; providing a process fluid; contacting the surface of the semiconductor workpiece with the process fluid; and raising the semiconductor workpiece relative to the process fluid following the contacting.

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