Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1993-06-07
1994-07-26
Ramsey, Kenneth J.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228223, B23K 120
Patent
active
053321456
ABSTRACT:
The invention provides a method that can be used online in a continuous printed circuit soldering process to measure and control the composition of soldering fluxes, in particular low-solids fluxes that utilize a solvent with a specific gravity close to the specific gravity of the flux composition. Samples of the flux are analyzed by ultra-violet absorption to determine solvent content and, based on this analysis, make up solvent is added to the flux composition to maintain a steady state composition.
REFERENCES:
patent: 5108024 (1992-04-01), Kazem-Goudarzi
Electronic Controls Design, Inc. Brochure (Rev. Jan. 1990).
Bell David R.
Brownell Paul V.
Compaq Computer Corporation
Ramsey Kenneth J.
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