Methods for connecting flexible circuit substrates to contact ob

Details Methods for connecting flexible circuit substrates to contact ob Methods for connecting flexible circuit substrates to contact ob

1994-08-11

1996-11-19

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

29846, H01R 909

Patent

active

055756620

ABSTRACT:
A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively.

REFERENCES:
patent: 4184729 (1980-01-01), Parks et al.
patent: 4453795 (1984-06-01), Moulin
patent: 4948374 (1990-08-01), Carter
patent: 5069628 (1991-12-01), Crumly
patent: 5147208 (1992-09-01), Bachler
patent: 5354205 (1994-10-01), Feigenbaum et al.

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