Package making – Methods – Filling preformed receptacle
Patent
1994-07-08
1995-11-28
Coan, James F.
Package making
Methods
Filling preformed receptacle
53 50, 53472, B65B 1700, B65B 5520
Patent
active
054696925
ABSTRACT:
Housings for personal computers are assembled at a first site and then shipped in bulk to one or more configuring sites. At the configuring sites, electrical components are inserted into the housing, and the thus-configured computers are packaged in individual containers, along with packing material. Each container has an openable vertical wall. If the computers need to be reconfigured, the openable wall of the container is opened, and one or more of the electrical components are removed and/or replaced horizontally through that opened wall without having to remove the computer or packing material from the container.
REFERENCES:
patent: 3482895 (1969-12-01), Becklin
patent: 4398212 (1983-08-01), Serry et al.
patent: 4658298 (1987-04-01), Takeda et al.
patent: 4837590 (1989-06-01), Sprague
patent: 5377476 (1995-01-01), Bohmer et al.
Apple Computer Inc.
Coan James F.
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