Methods for conditioning surfaces of polishing pads after...

Details Methods for conditioning surfaces of polishing pads after... Methods for conditioning surfaces of polishing pads after...

2006-02-07

2006-02-07

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S041000, C451S057000, C451S443000, C451S444000, C451S285000

Reexamination Certificate

active

06994612

ABSTRACT:
The invention includes a method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The method includes exposing the pad surface to steam, and the steam can comprise ammonium citrate. The invention also includes an apparatus for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The apparatus includes a conditioning stone, and a steam outlet port proximate the conditioning stone. The steam outlet port is configured to jet steam onto the pad surface during the conditioning of the pad surface.

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