Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-08
2006-08-08
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S125000
Reexamination Certificate
active
07087460
ABSTRACT:
A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate having a plurality of recesses formed therein. The semiconductor die is mounted to the interposer substrate with the conductive bumps disposed in the plurality of recesses so that the die face is adjacent the facing surface of the interposer substrate. One or more openings may be provided in an opposing surface of the interposer substrate which extend to the plurality of recesses and the conductive bumps disposed therein. Dielectric filler material may then be introduced through the one or more openings to the recesses and, optionally, between the semiconductor die and interposer substrate.
REFERENCES:
patent: 3239496 (1966-03-01), Jursich
patent: 4074342 (1978-02-01), Honn et al.
patent: 4807021 (1989-02-01), Okumura
patent: 4818728 (1989-04-01), Rai et al.
patent: 4954875 (1990-09-01), Clements
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5366794 (1994-11-01), Nakao
patent: 5385869 (1995-01-01), Liu et al.
patent: 5386341 (1995-01-01), Olson et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5404044 (1995-04-01), Booth et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5422205 (1995-06-01), Inoue et al.
patent: 5438477 (1995-08-01), Pasch
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5468995 (1995-11-01), Higgins, III
patent: 5489804 (1996-02-01), Pasch
patent: 5504277 (1996-04-01), Danner
patent: 5598033 (1997-01-01), Behlen et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 5663530 (1997-09-01), Schueller et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5674785 (1997-10-01), Akram et al.
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5683942 (1997-11-01), Kata et al.
patent: 5697148 (1997-12-01), Lance, Jr. et al.
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5719449 (1998-02-01), Strauss
patent: 5721151 (1998-02-01), Padmanabhan et al.
patent: 5723347 (1998-03-01), Hirano et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5742100 (1998-04-01), Schroeder et al.
patent: 5747982 (1998-05-01), Dromgoole et al.
patent: 5752182 (1998-05-01), Nakatsuka et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5768109 (1998-06-01), Gulick et al.
patent: 5777391 (1998-07-01), Nakamura et al.
patent: 5798285 (1998-08-01), Bentlage et al.
patent: 5798567 (1998-08-01), Kelly et al.
patent: 5805422 (1998-09-01), Otake et al.
patent: 5812378 (1998-09-01), Fjelstad et al.
patent: 5818113 (1998-10-01), Iseki et al.
patent: 5821624 (1998-10-01), Pasch
patent: 5834338 (1998-11-01), Takeda et al.
patent: 5834366 (1998-11-01), Akram
patent: 5834848 (1998-11-01), Iwasaki
patent: 5835355 (1998-11-01), Dordi
patent: 5843808 (1998-12-01), Karnezos
patent: 5844168 (1998-12-01), Schueller et al.
patent: 5844315 (1998-12-01), Melton et al.
patent: 5866953 (1999-02-01), Akram et al.
patent: 5886408 (1999-03-01), Ohki et al.
patent: 5891753 (1999-04-01), Akram
patent: 5892271 (1999-04-01), Takeda et al.
patent: 5898224 (1999-04-01), Akram
patent: 5905303 (1999-05-01), Kata et al.
patent: 5973389 (1999-10-01), Culnane et al.
patent: 5973404 (1999-10-01), Akram et al.
patent: 5977640 (1999-11-01), Bertin et al.
patent: 5982030 (1999-11-01), MacIntrye
patent: 5984691 (1999-11-01), Brodsky et al.
patent: 5986460 (1999-11-01), Kawakami
patent: 5990545 (1999-11-01), Schueller et al.
patent: 5991161 (1999-11-01), Samaras et al.
patent: 6005776 (1999-12-01), Holman et al.
patent: 6008543 (1999-12-01), Iwabuchi
patent: 6011694 (2000-01-01), Hirakawa
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6022761 (2000-02-01), Grupen-Shemansky et al.
patent: 6024584 (2000-02-01), Lemke et al.
patent: 6027346 (2000-02-01), Sinsheimer et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6034427 (2000-03-01), Lan et al.
patent: 6037665 (2000-03-01), Miyazaki
patent: 6039889 (2000-03-01), Zhang et al.
patent: 6040630 (2000-03-01), Panchou et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6050832 (2000-04-01), Lee et al.
patent: 6057178 (2000-05-01), Galuschki et al.
patent: 6060782 (2000-05-01), Ohsono et al.
patent: 6064114 (2000-05-01), Higgins, III
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6074897 (2000-06-01), Degani et al.
patent: 6075710 (2000-06-01), Lau
patent: 6079991 (2000-06-01), Lemke et al.
patent: 6093035 (2000-07-01), Lemke et al.
patent: 6116921 (2000-09-01), Scholz et al.
patent: 6124631 (2000-09-01), Cardot et al.
patent: 6127736 (2000-10-01), Akram
patent: 6133072 (2000-10-01), Fjelstad
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6137062 (2000-10-01), Zimmerman
patent: 6137164 (2000-10-01), Yew et al.
patent: 6137183 (2000-10-01), Sako
patent: 6157541 (2000-12-01), Hacke
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6172422 (2001-01-01), Chigawa et al.
patent: 6177723 (2001-01-01), Eng et al.
patent: 6179598 (2001-01-01), Brand
patent: 6180881 (2001-01-01), Isaak
patent: 6191487 (2001-02-01), Rodenbeck et al.
patent: 6208521 (2001-03-01), Nakatsuka
patent: 6208525 (2001-03-01), Imasu et al.
patent: 6212768 (2001-04-01), Murakami
patent: 6214156 (2001-04-01), Takano et al.
patent: 6217343 (2001-04-01), Okuno
patent: 6218202 (2001-04-01), Yew et al.
patent: 6219911 (2001-04-01), Estes et al.
patent: 6221763 (2001-04-01), Gilton et al.
patent: 6222265 (2001-04-01), Akram et al.
patent: 6225688 (2001-05-01), Kim et al.
patent: 6229711 (2001-05-01), Yoneda
patent: 6232666 (2001-05-01), Corisis et al.
patent: 6239496 (2001-05-01), Asada
patent: 6242932 (2001-06-01), Hembree
patent: 6262895 (2001-07-01), Forthun
patent: 6265775 (2001-07-01), Seyyedy
patent: 6271469 (2001-08-01), Ma et al.
patent: 6281046 (2001-08-01), Lam
patent: 6285081 (2001-09-01), Jackson
patent: 6291265 (2001-09-01), Mess
patent: 6291775 (2001-09-01), Saitoh
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6294455 (2001-09-01), Ahn
patent: 6295730 (2001-10-01), Akram
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6310288 (2001-10-01), Moden
patent: 6323060 (2001-11-01), Isaak
patent: 6338985 (2002-01-01), Greenwood
patent: 6376769 (2002-04-01), Chung
patent: 6404648 (2002-06-01), Slupe et al.
patent: 6407450 (2002-06-01), Verma et al.
patent: 6413102 (2002-07-01), Jiang et al.
patent: 6429516 (2002-08-01), Tsunoi
patent: 6432737 (2002-08-01), Webster
patent: 6452807 (2002-09-01), Barrett
patent: 6468831 (2002-10-01), Leong et al.
patent: 6482676 (2002-11-01), Tsunoi et al.
patent: 6489676 (2002-12-01), Taniguchi et al.
patent: 6489687 (2002-12-01), Hashimoto
patent: 6492737 (2002-12-01), Imasu et al.
patent: 6515324 (2003-02-01), Shibuya et al.
patent: 6518677 (2003-02-01), Capote et al.
patent: 6534853 (2003-03-01), Liu et al.
patent: 6552910 (2003-04-01), Moon et al.
patent: 6563223 (2003-05-01), Freeman
patent: 6586830 (2003-07-01), Saito
patent: 6600222 (2003-07-01), Levardo
patent: 6610559 (2003-08-01), Wang et al.
patent: 6634100 (2003-10-01), Akram et al.
patent: 6714418 (2004-03-01), Frankowsky et al.
patent: 6730855 (2004-05-01), Bando
patent: 6744122 (2004-06-01), Hashimoto
patent: 6756251 (2004-06-01), Lee
patent: 6791195 (2004-09-01), Urushima
patent: 2001/0048157 (2001-12-01), Murtuza
patent: 2001/0053563 (2001-12-01), Kim et al.
patent: 2002/0045611 (2002-04-01), Abrams et al.
patent: 2002/0079594 (2002-06-01), Sakurai
patent: 2002/0142513 (2002-10-01), Fee et al.
patent: 2002/0167092 (2002-11-01), Fee et al.
patent: 2002/0185661 (2002-12-01), Kawanobe et al.
patent: 2003/0042595 (2003-03-01), Canella
patent: 2003/0134450 (2003-07-01), Lee
patent: 2004/0026773 (2004-02-01), Koon et al.
patent: 2004/0212055 (2004-10-01), Exposito et al.
patent: 2004/0217454 (2004-11-01), Brechignac et al.
patent:
Geyer Scott
Micro)n Technology, Inc.
TraskBritt
LandOfFree
Methods for assembly and packaging of flip chip configured... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods for assembly and packaging of flip chip configured..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for assembly and packaging of flip chip configured... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3608661