Methods for assembling a stack package for high density...

Details Methods for assembling a stack package for high density... Methods for assembling a stack package for high density...

2006-12-19

2006-12-19

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE25031

Reexamination Certificate

active

07151010

ABSTRACT:
Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.

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