Methods for applying solder to an article

Details Methods for applying solder to an article Methods for applying solder to an article

1981-01-05

1983-03-15

Ramsey, Kenneth J.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228180A, 228246, H01L 2160

Patent

active

043765050

ABSTRACT:
A thick solder blob (56) is bonded to a land area 34 on a metallized substrate (31) by (a) depositing a thick layer of solder paste on the land area; (b) confining the solder paste with a hard material; and (c) reflowing the solder paste to bond the solder blob (56) to the land area (34) while maintaining the thickness thereof.

REFERENCES:
patent: 1572921 (1926-02-01), Gizienski
patent: 2941067 (1960-06-01), Kitrell
patent: 3589000 (1971-06-01), Galli
patent: 3719981 (1973-03-01), Steitz
patent: 4238528 (1980-12-01), Angelo et al.
patent: 4268585 (1981-05-01), Daur et al.
patent: 4273859 (1981-06-01), Mones et al.

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