Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-04-08
2008-04-08
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C438S456000, C438S637000, C257S623000, C257S704000, C257SE21577, C257SE23193
Reexamination Certificate
active
11269443
ABSTRACT:
Disclosed are embodiments of a method for forming a seal ring on a substrate that is anchored to the substrate by a number of vias. Also disclosed are embodiments of an assembly including such an anchored seal ring. In some embodiments, a seal ring may extend around the periphery of a MEMS device and may, in combination with a lid, provide a hermitic cavity enclosing the MEMS device. Other embodiments are described and claimed.
REFERENCES:
patent: 2003/0227094 (2003-12-01), Chou et al.
patent: 2006/0252262 (2006-11-01), Kazemi
patent: 2007/0075445 (2007-04-01), Gogoi
Dambrauskas Tony
Kinderknecht Daniel J.
Chambliss Alonzo
Intel Corporation
Nelson Kenneth A.
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