Methods for anchoring a seal ring to a substrate using vias...

Details Methods for anchoring a seal ring to a substrate using vias... Methods for anchoring a seal ring to a substrate using vias...

2008-04-08

2008-04-08

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000, C438S456000, C438S637000, C257S623000, C257S704000, C257SE21577, C257SE23193

Reexamination Certificate

active

07354799

ABSTRACT:
Disclosed are embodiments of a method for forming a seal ring on a substrate that is anchored to the substrate by a number of vias. Also disclosed are embodiments of an assembly including such an anchored seal ring. In some embodiments, a seal ring may extend around the periphery of a MEMS device and may, in combination with a lid, provide a hermitic cavity enclosing the MEMS device. Other embodiments are described and claimed.

REFERENCES:
patent: 2003/0227094 (2003-12-01), Chou et al.
patent: 2006/0252262 (2006-11-01), Kazemi
patent: 2007/0075445 (2007-04-01), Gogoi

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