Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2005-03-08
2005-03-08
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S106000
Reexamination Certificate
active
06864153
ABSTRACT:
A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to each other. The pressure sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the hybrid adhesive material may be heated to cure the thermoset component thereof and to more permanently secure the semiconductor device components to one another. The cure temperature may be lower than about 200° C. and as low as about 120° C. or less. A system for effecting the method of the present invention is also disclosed, as well as semiconductor device assemblies that include the hybrid adhesive material.
REFERENCES:
patent: 4557860 (1985-12-01), DiSalvo et al.
patent: 4604230 (1986-08-01), Goswami et al.
patent: 4664739 (1987-05-01), Aurichio
patent: 4687693 (1987-08-01), Sheyon et al.
patent: 5006575 (1991-04-01), Chan
patent: 5250600 (1993-10-01), Nguyen et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5371178 (1994-12-01), Nguyen
patent: 5386000 (1995-01-01), Nguyen
patent: 5448450 (1995-09-01), Burns
patent: 5488082 (1996-01-01), Dietz et al.
patent: 5489637 (1996-02-01), Nguyen et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5612403 (1997-03-01), Nguyen et al.
patent: 5804631 (1998-09-01), Mine et al.
patent: 5840598 (1998-11-01), Grigg et al.
patent: 5912282 (1999-06-01), Iyer et al.
patent: 5912316 (1999-06-01), Nguyen et al.
patent: 5964979 (1999-10-01), George et al.
patent: 5973052 (1999-10-01), Iyer et al.
patent: 5982041 (1999-11-01), Mitani et al.
patent: 6012502 (2000-01-01), VanNortwick et al.
patent: 6159609 (2000-12-01), Evers
patent: 6259592 (2001-07-01), Ono
patent: 6426552 (2002-07-01), Reeder et al.
patent: 6544864 (2003-04-01), Reeder et al.
Jiang Tongbi
Reeder W. Jeff
Micro)n Technology, Inc.
Nhu David
TraskBritt
LandOfFree
Methods employing hybrid adhesive materials to secure... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods employing hybrid adhesive materials to secure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods employing hybrid adhesive materials to secure... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3426300