Methods, devices, and computer program products for...

Details Methods, devices, and computer program products for... Methods, devices, and computer program products for...

2005-07-25

2009-12-15

Ensey, Brian (Department: 2614)

Electrical audio signal processing systems and devices

Hearing aids, electrical

Wideband gain control

C381S312000, C381S331000

Reexamination Certificate

active

07634098

ABSTRACT:
An audio signal received at a mobile device is processed using a first set of equalization parameters in an acoustic coupling mode of operation, and is processed using a second set of equalization parameters in an inductive coupling mode of operation. The processed audio signal is transmitted to a speaker associated with the mobile device for acoustic coupling to a human ear and/or a hearing aid microphone, or for inductive coupling to a hearing aid telecoil.

REFERENCES:
patent: 5842115 (1998-11-01), Dent
patent: 6122500 (2000-09-01), Dent et al.
patent: 6658126 (2003-12-01), Stern
patent: 7248713 (2007-07-01), Bren et al.
patent: 2003/0059076 (2003-03-01), Martin
patent: 2004/0037443 (2004-02-01), Beimel et al.
patent: 10223544 (2003-07-01), None
patent: 1196008 (2002-04-01), None
patent: 1296537 (2003-03-01), None
patent: 1379103 (2004-01-01), None
patent: 1416765 (2004-05-01), None
patent: 09018998 (1997-01-01), None
patent: 10126466 (1998-05-01), None
Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration corresponding to PCT/US2006/012814 mailed on Oct. 18, 2006.

Affiliated with

Also associated with

Rating

Methods, devices, and computer program products for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods, devices, and computer program products for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods, devices, and computer program products for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4084717