Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate
2006-11-07
2006-11-07
Goudreau, George A. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
For liquid etchant
C156S345130, C451S005000, C451S066000
Reexamination Certificate
active
07132035
ABSTRACT:
Methods, apparatuses and substrate assembly structures for mechanical and chemical-mechanical planarizing processes used in the manufacturing microelectronic-device substrate assemblies. One aspect of the invention is directed toward a method for planarizing a microelectronic-device substrate assembly by removing material from a surface of the substrate assembly, detecting a first change in drag force between the substrate assembly and a polishing pad indicating that the substrate surface is planar, and identifying a second change in drag force between the substrate assembly and the polishing pad indicating that the planar substrate surface is at the endpoint elevation. After the second change in drag force is identified, the planarization process is stopped. The first change in drag force between the substrate assembly and the planarizing medium is preferably detected by measuring a first change in the electrical current through a drive motor driving a substrate holder carrying the substrate assembly and/or a table carrying the polishing pad. The second change in drag force between the substrate assembly and the polishing pad may be identified by detecting a second change in the drive motor current or measuring a second change in the temperature of the planarizing solution or the polishing pad.
REFERENCES:
patent: 4879258 (1989-11-01), Fisher
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5597442 (1997-01-01), Chen et al.
patent: 5643046 (1997-07-01), Katakabe et al.
patent: 5643050 (1997-07-01), Chen
patent: 5647952 (1997-07-01), Chen
patent: 5652177 (1997-07-01), Pan
patent: 5722875 (1998-03-01), Iwashita et al.
patent: 5738562 (1998-04-01), Doan et al.
patent: 5817572 (1998-10-01), Chiang et al.
patent: 5830041 (1998-11-01), Takahashi et al.
patent: 5846882 (1998-12-01), Birang
patent: 5882244 (1999-03-01), Hiyama et al.
patent: 5981353 (1999-11-01), Tsai
patent: 5981354 (1999-11-01), Spikes et al.
patent: 6007408 (1999-12-01), Sandhu
patent: 6046111 (2000-04-01), Robinson
patent: 6066550 (2000-05-01), Wang
patent: 6077783 (2000-06-01), Allman et al.
patent: 6080670 (2000-06-01), Miller et al.
patent: 6146973 (2000-11-01), He et al.
patent: 6150072 (2000-11-01), Shoda et al.
patent: 6191037 (2001-02-01), Robinson et al.
patent: 6241847 (2001-06-01), Allman et al.
patent: 6352466 (2002-03-01), Moore
patent: 06-252112 (1994-09-01), None
patent: 07-297193 (1995-11-01), None
patent: 09-262743 (1997-10-01), None
patent: 10-202522 (1998-08-01), None
patent: 10-202523 (1998-08-01), None
“End Point Detector for Chemi-Mechanical Polisher,” IBM Technical Disclosure Bulletin, vol. 31, No. 4, Sep. 1988.
“Model 6DQ Servo Controlled Polisher,” R. Howard Strasbaugh, Inc., Huntington Beach, CA, p. 8, Apr. 1987.
Pan Pai-Hung
Robinson Karl M.
Dorsey & Whitney LLP
Goudreau George A.
Micro)n Technology, Inc.
LandOfFree
Methods, apparatuses, and substrate assembly structures for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods, apparatuses, and substrate assembly structures for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods, apparatuses, and substrate assembly structures for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3694319