Methods and systems of packaging integrated circuits

Details Methods and systems of packaging integrated circuits Methods and systems of packaging integrated circuits

2006-07-10

2011-10-04

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S112000, C438S127000, C438S464000, C257SE21502, C257SE21505

Reexamination Certificate

active

08030138

ABSTRACT:
Panel level methods and systems for packaging integrated circuits are described. In a method aspect of the invention, a substrate formed from a sacrificial semiconductor wafer is provided having a plurality of metallized device areas patterned thereon. Each device area includes an array of metallized contacts and a die attach area. Dice are mounted onto each device area and electrically connected to the array of contacts. The entire surface of the substrate including the dice, contacts and electrical connections is then encapsulated. The semiconductor wafer is then sacrificed leaving portions of the contacts exposed allowing the contacts to be used as external contacts in an IC package. In various embodiments, other structures, including die attach pads, may be incorporated into the device areas as desired. By way of example, structures having thicknesses in the range of 10 to 20 microns are readily attainable.

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