Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-11-20
2009-08-04
Le, Brian Q (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S145000, C382S151000
Reexamination Certificate
active
07570796
ABSTRACT:
Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
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Chang Ellis
Kekare Sagar
Park Allen
Rose Peter
Zafar Khurram
KLA-Tencor Technologies Corp.
Le Brian Q
Mewherter Ann Marie
LandOfFree
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