Methods and systems for processing a substrate using a...

Details Methods and systems for processing a substrate using a... Methods and systems for processing a substrate using a...

2006-01-24

2006-01-24

Gravini, Stephen (Department: 3749)

Drying and gas or vapor contact with solids

Process

Gas or vapor pressure is subatmospheric

C034S058000, C034S092000, C134S031000, C216S084000

Reexamination Certificate

active

06988327

ABSTRACT:
A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

REFERENCES:
patent: 4838289 (1989-06-01), Kottman et al.
patent: 5271774 (1993-12-01), Leenaars et al.
patent: 5660642 (1997-08-01), Britten
patent: 5705223 (1998-01-01), Bunkofske
patent: 5807522 (1998-09-01), Brown et al.
patent: 5882433 (1999-03-01), Ueno
patent: 5945351 (1999-08-01), Mathuni
patent: 5973447 (1999-10-01), Mahoney et al.
patent: 5975098 (1999-11-01), Yoshitani et al.
patent: 5989478 (1999-11-01), Ouellette et al.
patent: 5997653 (1999-12-01), Yamasaka
patent: 6398975 (2002-06-01), Mertens et al.
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6531206 (2003-03-01), Johnston et al.
patent: 2002/0121290 (2002-09-01), Tang et al.
patent: 2002/0125212 (2002-09-01), Mertens et al.
patent: 0 905 746 (1999-03-01), None
patent: 02280330 (1990-11-01), None
patent: 02309638 (1990-12-01), None
patent: 11350169 (1999-12-01), None
patent: WO 99/16109 (1999-04-01), None
patent: WO 02/001613 (2002-01-01), None
patent: WO 02/32825 (2002-04-01), None
patent: WO 02/101795 (2002-12-01), None
PCT International Search Report

Affiliated with

Also associated with

Rating

Methods and systems for processing a substrate using a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and systems for processing a substrate using a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and systems for processing a substrate using a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3559834