Methods and systems for precisely relatively positioning a...

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C356S121000, C219S121780

Reexamination Certificate

active

07027155

ABSTRACT:
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

REFERENCES:
patent: 4044222 (1977-08-01), Kestenbaum
patent: 4399345 (1983-08-01), Lapham et al.
patent: 4425037 (1984-01-01), Hershel et al.
patent: 4475223 (1984-10-01), Taniguchi et al.
patent: 4504144 (1985-03-01), Trost
patent: 4528451 (1985-07-01), Petric et al.
patent: 4532402 (1985-07-01), Overbeck
patent: 4584479 (1986-04-01), Lamattina et al.
patent: 4598039 (1986-07-01), Fischer et al.
patent: 4615621 (1986-10-01), Allen et al.
patent: 4675501 (1987-06-01), Klingel
patent: 4685054 (1987-08-01), Manninen et al.
patent: 4710908 (1987-12-01), Ohshima et al.
patent: 4752668 (1988-06-01), Rosenfield et al.
patent: 4769523 (1988-09-01), Tanimoto et al.
patent: 4826785 (1989-05-01), McClure et al.
patent: 4827325 (1989-05-01), Or-Bach et al.
patent: 4849901 (1989-07-01), Shimizu
patent: 4935801 (1990-06-01), McClure et al.
patent: 4952858 (1990-08-01), Galburt
patent: 5059764 (1991-10-01), Baer
patent: 5134298 (1992-07-01), Inagaki et al.
patent: 5208437 (1993-05-01), Miyauchi et al.
patent: 5265114 (1993-11-01), Sun et al.
patent: 5294567 (1994-03-01), Dorfman et al.
patent: 5300756 (1994-04-01), Cordingley
patent: 5340962 (1994-08-01), Schmidt et al.
patent: 5386294 (1995-01-01), Ototake et al.
patent: 5473624 (1995-12-01), Sun
patent: 5502311 (1996-03-01), Imai et al.
patent: 5594235 (1997-01-01), Lee
patent: 5667707 (1997-09-01), Klingel et al.
patent: 5690785 (1997-11-01), Nakaya
patent: 5783814 (1998-07-01), Fairley et al.
patent: 5837962 (1998-11-01), Overbeck
patent: 5841099 (1998-11-01), Owen et al.
patent: 5998759 (1999-12-01), Smart
patent: 6036162 (2000-03-01), Hayashi
patent: 6057180 (2000-05-01), Sun et al.
patent: 6103991 (2000-08-01), Domae et al.
patent: 6103992 (2000-08-01), Noddin
patent: 6144118 (2000-11-01), Cahill et al.
patent: 6172325 (2001-01-01), Baird et al.
patent: 6177648 (2001-01-01), Lawson et al.
patent: 6177998 (2001-01-01), Svetkoff et al.
patent: 6181728 (2001-01-01), Cordingley et al.
patent: 6191486 (2001-02-01), Bernstein
patent: 6198982 (2001-03-01), Park et al.
patent: 6215896 (2001-04-01), Greig et al.
patent: 6239406 (2001-05-01), Onoma et al.
patent: 6281471 (2001-08-01), Smart
patent: 6297541 (2001-10-01), Ema et al.
patent: 6300590 (2001-10-01), Lauer et al.
patent: 6339604 (2002-01-01), Smart
patent: 6340806 (2002-01-01), Smart et al.
patent: 6396640 (2002-05-01), Otomu
patent: 6407363 (2002-06-01), Dunsky et al.
patent: 6472295 (2002-10-01), Morris et al.
patent: 6511627 (2003-01-01), Asahi et al.
patent: 6534743 (2003-03-01), Swenson
patent: 6600131 (2003-07-01), Virtanen et al.
patent: 6689985 (2004-02-01), Lipman et al.
patent: 2001/0045419 (2001-11-01), Dunsky et al.
patent: 2002/0003130 (2002-01-01), Sun et al.
patent: 2002/0005396 (2002-01-01), Baird et al.
patent: 2002/0009843 (2002-01-01), Kyusho et al.
patent: 0902 474 (1999-03-01), None
patent: 05-235169 (1993-03-01), None
patent: 04-006599 (1993-08-01), None
patent: 2531453 (1996-06-01), None
patent: WO 01/87534 (2001-11-01), None
Damaseus, Novellus, Benefits of Copper—Copper Technology is Here Today in Working Devices, Dec. 20, 2001.
Litwin, et al., Laser Adjustment of Linear Monolithic Circuits, ICAELO, 1983.
Scarfone, L.M., et al., Computer Simulation of Target Link Exlosion in Laser Programmable Redundancy For Silicon Memory, Mar./Apr. 1986.
Boogard, Jerry, Precision Laser Micromachining, SPIE, vol. 611, Portland, Oregon, 1986, pp. 48-59.
Smart, Donald, et al., Laser Processing For Application Specific Integrated circuits (ASICS), SPIE, vol. 774, 1987, pp. 88-92.
Xenon Laser Repairs Liquid Crystal Displays, Waters, Laser and Optronics, Apr. 1988, vol. 7, No. 4.
Sun, et al., Optimization of Memory Redundancy Link Processing, vol. SPIE 2636, 1995.
Bernstein, Joseph, et al., Analysis of Laser Metal Cut Energy Process Window, IEEE Trans. on Semicond. Manufact., vol. 13, No. 2, May 20000, pp. 228-234.
Smart, Don, Optimization of Semiconductor Layer Thickness For Repair of RAMs, Application Report 150, Teradyne, pp. 1-9.
Jandeleit, J., et al., Picosecond Laser Ablation of Thin Copper Films, Applied Physics A, A63, pp. 117-121, 1996.
Zhu, X., et al., Influence of Laser Parameters And Material Properties On Micro Drilling With Feemtosecond Laser Pulses, Applied Physics A, A69, pp. 367-S371, 1999.
North, J.C., Laser Vaporization of Metal Films—Effect of Optical Interference In Underlying Dielectric Layers, Jounal of Applied Physics, vol. 48, No. 6, Jun. 1977.
Sun, Yunlong, Interference Effect on Laser Trimming And Layer Thickness Optimization, SPIE, vol. 1598, 1991.
Brisbane, A.D., et al., Electric Compon, 1968, pp. 147.
Elliott, David, Ultraviolet Laser Technology And Applications, Wayland, MA, 1995, pp. 137-141.
Link Cutting/Making, Handbook of Laser Materials Processing, Chapter 19, pp. 595-615, ISBN 0-912035-15-3.
Cacouris, Ted., Preventing Cross-Contamination Caused By Coopper Diffusion And Other Sources, Micro, Jul./Aug. 1999, pp. 43-52.
Cohen, Simon, et al., Laser Beam Processing and Wafer Scale Integration, 1988, pp. 85-111.
Smart, Donald, et al., Link Processing With Lasers, General Scanning, Inc., 1998, pp. 1-20.
Nikoonahad, Mehrdad, et al., In Situ Height Correction For Laser Scanning of Semiconductor Wafers, Optical Engineering, Oct. 1995, vol. 34, No. 10, pp. 3036-3039.
Montagu, Laser Beam Scanning, Galvanometric and Resonant Low Inertia Scanners, 1985, pp. 214-217, pp. 226-229, pp. 246-251.
Kuttner, Paul, Laser Beam Scanning, Opto-Mechanical Devices, Systems and Data Storage Optics, Chapter 7, “Optics For Data Storage”, pp. 303-306, pp. 331-332, pp. 383-390.
Electro Scientific Industries, Inc. 9300 Memory Yield Improvement, 1998, 2 pages.
Electro Scientific Industries, Inc. 9350 Laser Semiconductor Processing System, 2001, 2 pages.
General Scanning, Inc., Laser Link Fusing, Somerville, MA, Jan. 1997.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods and systems for precisely relatively positioning a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and systems for precisely relatively positioning a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and systems for precisely relatively positioning a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3586588

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.