Methods and systems for packaging integrated circuits

Details Methods and systems for packaging integrated circuits Methods and systems for packaging integrated circuits

2008-01-24

2011-11-01

Hu, Shouxiang (Department: 2811)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S108000, C438S113000, C438S458000, C257SE21503

Reexamination Certificate

active

08048781

ABSTRACT:
Methods of packaging integrated circuits are described. One method relates to attaching a singulated device wafer to a substrate. The singulated device wafer includes a multiplicity of integrated circuit dice arranged in a first configuration. The method also involves a substrate, which includes a sacrificial semiconductor wafer having device areas with metalized contacts. The device areas on the substrate may be arranged in a configuration matching that of the dice on the device wafer. The method also entails aligning the singulated device wafer as a whole with the substrate so that the dice of the device wafer are positioned substantially simultaneously over associated device areas on the substrate. The method also involves attaching the dice from the singulated wafer as a whole substantially simultaneously to the substrate such that each die of the device wafer is attached to an associated device area of the substrate.

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