Methods and systems for laser machining a substrate

Details Methods and systems for laser machining a substrate Methods and systems for laser machining a substrate

2002-10-01

2011-11-01

Nguyen, Thanh (Department: 2893)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S977000, C438S460000, C257SE21482

Reexamination Certificate

active

08048774

ABSTRACT:
A formation in a first surface of a substrate is machined by an ultraviolet or visible radiation laser, to a predetermined depth that is less than a full depth of the substrate; and material is removed from a second surface of the substrate opposed to the first surface to the predetermined depth from the first surface to communicate with the formation. Material may be removed by, for example, lapping and polishing, chemical etching, plasma etching or laser ablation. The invention has application in, for example, dicing semiconductor wafers to forming metallised vias in wafers.

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