Methods and systems for inspection of a wafer

Details Methods and systems for inspection of a wafer Methods and systems for inspection of a wafer

2005-10-06

2009-06-30

Stafira, Michael P (Department: 2886)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237200

Reexamination Certificate

active

07554656

ABSTRACT:
Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.

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