Methods and systems for identifying defect types on a wafer

Details Methods and systems for identifying defect types on a wafer Methods and systems for identifying defect types on a wafer

2007-12-03

2010-06-01

Toatley, Jr., Gregory J (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237100

Reexamination Certificate

active

07728969

ABSTRACT:
Various methods and systems for identifying defect types on a wafer are provided. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer. The output is acquired by different combinations of illumination and collection channels of the inspection system. The method also includes identifying defect types of the defects based on the output acquired by a set of the different combinations. The set of the different combinations is selected based on the defect types to be identified on the wafer and a wafer type of the wafer such that a different set of the different combinations of the illumination and collection channels is used for identifying different defect types on different wafer types.

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