Methods and systems for forming a die package

Details Methods and systems for forming a die package Methods and systems for forming a die package

2006-09-12

2006-09-12

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S827000, C029S840000, C438S126000, C438S127000

Reexamination Certificate

active

07103969

ABSTRACT:
The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

REFERENCES:
patent: 4504845 (1985-03-01), Kattner et al.
patent: 5477611 (1995-12-01), Sweis et al.
patent: 5697144 (1997-12-01), Mitani et al.
patent: 5776796 (1998-07-01), Distefano et al.
patent: 6041501 (2000-03-01), Suzuki et al.
patent: 6214640 (2001-04-01), Fosberry et al.
patent: 6232152 (2001-05-01), DiStefano et al.
patent: 6261502 (2001-07-01), Herbst
patent: 6359335 (2002-03-01), Distefano et al.
patent: 6494566 (2002-12-01), Kishino et al.
patent: 6698092 (2004-03-01), Bretl et al.
patent: 6951779 (2005-10-01), Farnworth
patent: 2 189 746 (1987-11-01), None

Affiliated with

Also associated with

Rating

Methods and systems for forming a die package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and systems for forming a die package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and systems for forming a die package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3527751