Methods and systems for fabricating electrical connections...

Details Methods and systems for fabricating electrical connections... Methods and systems for fabricating electrical connections...

2005-05-03

2005-05-03

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S762000, C257S750000, C257S632000, C257S643000, C257S644000, C257S650000, C257S774000

Reexamination Certificate

active

06888224

ABSTRACT:
Low-k dielectric materials have desirable insulating characteristics for use in insulating sub micron conductors in semiconductor devices. However, certain physical and material characteristics of the low-k dielectric materials make them difficult to work with. More particularly, the soft, porous, leakage-prone characteristics of low-k materials makes it difficult to accommodate electrical contacts for electrical probing to conductors covered by such materials. The present invention provides methods and structures for facilitating the electrical probing of semiconductor device conductors insulated by overlying low-k layers of dielectric material.

REFERENCES:
patent: 6514881 (2003-02-01), Coffman

Affiliated with

Also associated with

Rating

Methods and systems for fabricating electrical connections... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and systems for fabricating electrical connections..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and systems for fabricating electrical connections... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3413047