Data processing: structural design – modeling – simulation – and em – Modeling by mathematical expression
Reexamination Certificate
2001-06-01
2009-06-09
Phan, Thai (Department: 2128)
Data processing: structural design, modeling, simulation, and em
Modeling by mathematical expression
C703S006000, C703S022000, C700S032000, C705S007380
Reexamination Certificate
active
07546225
ABSTRACT:
Methods and systems for electronics assembly system consultation and sales build upon an approach to modeling and simulation of such systems in which the system is modeled at a preselected level of abstraction, which in the preferred embodiment of the invention is the material flow level of abstraction. Models capable of producing accurate results, but that avoid predicting system events at too low a level of detail, in turn permit the generation of configuration options for a customer, along with substantiated performance predictions, within a comparatively short period of time, one that permits various assembly system configurations to be proposed and evaluated within the course of a particular customer visit.
REFERENCES:
patent: 5539652 (1996-07-01), Tegethoff
patent: 5793632 (1998-08-01), Fad et al.
patent: 5907489 (1999-05-01), Elliott
patent: 6064982 (2000-05-01), Puri
patent: 6161101 (2000-12-01), Guinta et al.
patent: 6810401 (2004-10-01), Thompson et al.
patent: 6983232 (2006-01-01), Nguyen et al.
patent: 2003/0172002 (2003-09-01), Spira et al.
patent: 2006/0059253 (2006-03-01), Goodman et al.
Worhach et al, “Integration of Environmental Factors in Process Modeling for Printed Circuit Board Manufacturing, Part I: Assembly,” Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, pp. 218-225 (May 1997).
Varney, “Arm Your Salesforce with the Web,” Datamation, vol. 42 Issue 16, pp. 72-74 (Oct. 1996).
Przekwas et al, “A Virtual Prototyping Environment for Multi-Scale, Multi-Disciplinary Simulation of Electronics Packaging of MCMs,” IEEE Inter-Society Conference on Thermal Phenomena in Electronic Systems, pp. 352-358 (May 1996).
Dance et al, “Modeling the cost of ownership of assembly and inspection,” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part C, vol. 19 Issue 1, pp. 57-60 (Jan. 1996).
Duck Anthony Peter
Gray Robert
Mair Thomas
Nguyen Tuan
Rawles Ian
Phan Thai
Siemens Energy & Automation Inc.
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