Measuring and testing – Surface and cutting edge testing – Roughness
Reexamination Certificate
2004-09-03
2008-10-07
Larkin, Daniel S (Department: 2856)
Measuring and testing
Surface and cutting edge testing
Roughness
C977S851000, C977S863000, C977S868000, C977S869000, C977S881000
Reexamination Certificate
active
07430898
ABSTRACT:
A system that includes an optical subsystem and an atomic force microscope probe is provided. The optical subsystem is configured to generate positional information about a location on a surface of the specimen. The system is configured to position the probe proximate the location based on the positional information. One method includes generating positional information about a location on a surface of a specimen with an optical subsystem. The method also includes positioning an atomic force microscopy probe proximate the location based on the positional information. Another system includes an optical subsystem configured to measure overlay of a wafer using scatterometry. The system also includes an atomic force microscope configured to measure a characteristic of a feature on the wafer. An additional method includes measuring overlay of a wafer using scatterometry. The method also includes measuring a characteristic of a feature on the wafer using atomic force microscopy.
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Bevis Christopher F.
Faeyrman Michael
Weber-Grabau Michael
Zamir Ofir
Baker & McKenzie LLP
KLA-Tencor Technologies Corp.
Larkin Daniel S
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