Methods and system for thermal analysis of electronic packages

Details Methods and system for thermal analysis of electronic packages Methods and system for thermal analysis of electronic packages

1994-12-29

1997-07-01

Herndon, Heather R.

395123, G06T 1500

Patent

active

056446870

ABSTRACT:
A solid model of each part within an electronic package is created and assigned at least one non-geometrical property. For example, this may comprise automatically extracting information from a printed circuit board design tool and creating solid models of a printed circuit board and the parts thereon. Thereafter, each solid model is subdivided into multiple finite control volumes. A plurality of boundary conditions are automatically established for each of the multiple finite control volumes of each part using that part's non-geometrical property. Thermal analysis may then be performed on the electronic package using the boundary conditions for each finite control volume of each solid model of each part contained therewithin.

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