Methods and structures for pad reconfiguration to allow intermed

Details Methods and structures for pad reconfiguration to allow intermed Methods and structures for pad reconfiguration to allow intermed

1999-05-13

2000-05-30

Picardat, Kevin M.

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324765, 438 15, 438612, H01L 2166

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active

060688920

ABSTRACT:
Methods and structures for pad reconfiguration to allow intermediate testing during the manufacture of an integrated circuit are disclosed. The methods and structures disclosed are particularly useful in testing an embedded subcircuit, such as a memory array within an embedded chip product. A bond pad reconfiguration etch and other means for reconfiguring a bond pad are also disclosed.

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