Methods and structure for IC temperature self-monitoring

Details Methods and structure for IC temperature self-monitoring Methods and structure for IC temperature self-monitoring

2005-10-25

2005-10-25

Bui, Bryan (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Temperature measuring system

C702S130000, C702S136000

Reexamination Certificate

active

06959258

ABSTRACT:
Methods and systems are provided for thermal self-monitoring of integrated circuits. Temperature is sensed, digitized, encoded, and compared to one or more threshold values by circuits added within an integrated circuit. A signal produced by a thermal diode within an integrated circuit is applied to an analog to digital converter and may be compared to one or more threshold values to produce a digital over temperature condition signal. An appropriate cooling action may be initiated by processing of the digital signal so produced. Also provided are methods and systems to alter the range and resolution of the temperature threshold comparisons.

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patent: 5291387 (1994-03-01), Ohshima
patent: 6172611 (2001-01-01), Hussain et al.
patent: 2003/0158697 (2003-08-01), Gold et al.
IC Temperature Sensors Find the Hot Spots (http://www.dalsemi.com/appnotes.cfm/appnote_number/689) Jul. 2, 1998 issue ofEDN; 6 pages.

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