Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1994-11-15
1996-06-04
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228191, 228194, 20429813, B23K 3102
Patent
active
055225357
ABSTRACT:
Methods for facilitating recycling of backing plates in bonded target/backing plate assemblies and structural assemblies for use in these methods are disclosed. The target and backing plate are joined by a solder paste material that may be applied to adjoining surfaces of the target and backing plate at low temperature. The paste solidifies to have a high decomposition temperature on the order of greater than 400.degree. C. Provision of a solder layer having a liquidus temperature of about 100.degree.-250.degree. C. between the backing plate and solder paste allows for easy target and backing plate separation and subsequent backing plate reusage.
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Boldyrev Vladimir V.
Grigoriva Tatyana F.
Ivanov Eugene Y.
Heinrich Samuel M.
Tosoh SMD, Inc.
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