Methods and media for processing a circuit board

Details Methods and media for processing a circuit board Methods and media for processing a circuit board

2011-06-14

2011-06-14

Hartman, Jr., Ronald D (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S121000, C716S050000, C716S051000, C716S052000, C716S106000, C716S118000, C716S119000, C716S139000

Reexamination Certificate

active

07962232

ABSTRACT:
A method of processing a circuit board including providing a circuit board having disposed thereon a conductive pattern, the pattern comprising a trace terminating at a terminal and depositing conductive material on the terminal and trace to form a land extending away from the terminal on the trace past a projection line. The method also includes applying a soldermask to the circuit board to form a soldermask opening having an opening edge located at and aligned with the projection line, with the opening framing the terminal and a first portion of the land, and to cover a second portion of the land.

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2008 Signal Integrity Training Classes; 2 pages.
PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages; 9 pages.
Land Repair, Film Adhesive Method; 4 pages.

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