Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Patent
1979-10-11
1981-03-10
Lesmes, George F.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
428436, 428460, 428483, 428494, 428506, 428524, 428529, 260 293, B32B 2742, B32B 1500, B32B 900
Patent
active
042554861
ABSTRACT:
The strength of the bond obtained between substates with the aid of phenoplasts, modified phenoplasts and/or epoxy resins, e.g. between fibrous material and an elastomer on vulcanization thereof, is improved by applying, to at least one of the substrates, in addition to a preformed phenoplast, modified preformed phenoplast, and/or preformed epoxy resin, and drying thereon before the assembly thereof with the other substrate, as an adhesion promoter, a quantity of m-aminophenol, which may be blended in a phenoplast adhesive, such as an RF dip or an RFL dip, or may be blended in the elastomer latex used for forming an RFL dip. Adhesive/promoter blends and latex/promoter blends for forming the same are also disclosed.
REFERENCES:
patent: 3018207 (1962-01-01), Danielson
patent: 3423230 (1969-01-01), Georges
patent: 3507689 (1970-04-01), Freytag et al.
patent: 3513049 (1970-05-01), Marzocchi
patent: 3537932 (1970-11-01), Schrode
patent: 3663268 (1972-05-01), Wilson
patent: 3698935 (1972-10-01), Yurcick et al.
patent: 3719724 (1973-03-01), Freeman
patent: 3922468 (1975-11-01), Burke et al.
patent: 4012350 (1977-03-01), Burke et al.
patent: 4131584 (1978-12-01), Burke et al.
Burke, Jr. Oliver W.
Hunt Barbara P.
Darrah Marion
Houghton Joseph Y.
Lesmes George F.
Thomas Alexander S.
LandOfFree
Methods and means for improvings resin bonds between substrates, does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and means for improvings resin bonds between substrates,, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and means for improvings resin bonds between substrates, will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1294626