Methods and materials useful for chip stacking, chip and...

Details Methods and materials useful for chip stacking, chip and... Methods and materials useful for chip stacking, chip and...

2011-04-26

2011-04-26

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257S781000, C257S782000, C257SE21122

Reexamination Certificate

active

07932161

ABSTRACT:
Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.

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