Methods and materials for conducting heat from electronic compon

Details Methods and materials for conducting heat from electronic compon Methods and materials for conducting heat from electronic compon

1978-04-14

1981-11-10

Davis, Albert W.

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

165185, 165DIG8, C09K 500, F28F 700

Patent

active

042997151

ABSTRACT:
A heat conductive material in solid form which is readily excoriated whereby it can be applied by rubbing on the surface to which it is to be applied is formed, in the preferred form, by mixing finely divided heat conducting solids in a waxy material. That material is formed of waxes, or certain fats, and is solid in the range of normal room temperatures. In preferred form it becomes molten at temperatures in that range just above normal room temperature at which heat generating electronic semi-conductor devices often operate.
The mixture is applied at normal room temperature by rubbing, or at elevated temperature by painting. It is applied to the surfaces to be mated and across which heat is to be conducted whereupon the surfaces are mated with the coating between them.

REFERENCES:
patent: 2799793 (1957-07-01), DeCain
patent: 2887628 (1959-05-01), Zierdt
patent: 3013104 (1961-12-01), Young
patent: 3249680 (1966-05-01), Sheets et al.
patent: 3356828 (1967-12-01), Furness
patent: 3463140 (1969-08-01), Rollor
patent: 3463161 (1969-08-01), Andrassy
patent: 3603106 (1971-09-01), Ryan
patent: 3819530 (1974-06-01), Ratledge et al.
patent: 3823089 (1974-07-01), Ryan

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