Methods and devices for modifying a substrate surface

Details Methods and devices for modifying a substrate surface Methods and devices for modifying a substrate surface

2007-08-21

2007-08-21

Warden, Jill A. (Department: 1743)

Chemical apparatus and process disinfecting, deodorizing, preser

Process disinfecting, preserving, deodorizing, or sterilizing

Using sonic or ultrasonic energy

C510S179000, C510S400000, C510S475000, C216S089000

Reexamination Certificate

active

10632600

ABSTRACT:
Methods and compositions for modifying a substrate surface are provided. In accordance with the subject methods, a substrate surface is contacted with a particulate-containing fluid. The fluid is then ultrasonically or sonically agitated to modify the substrate surface. In certain embodiments, the particulate-containing fluid has a pH above the isoelectric point of the substrate. Also provided are devices capable of providing ultrasonic and/or sonic energy and which include a non-acidic, particulate-containing fluid. The subject invention also provides systems and kits for use in practicing the subject methods.

REFERENCES:
patent: 3866398 (1975-02-01), Vernon et al.
patent: 3997358 (1976-12-01), Taylor
patent: 4116851 (1978-09-01), Rupe et al.
patent: 4328047 (1982-05-01), Dalton
patent: 5418136 (1995-05-01), Miller et al.
patent: 5968280 (1999-10-01), Ronay
patent: 6130015 (2000-10-01), Noddin et al.
patent: 6221118 (2001-04-01), Yoshida et al.
patent: 6918397 (2005-07-01), Lin et al.
patent: 2002/0007209 (2002-01-01), Scheerder et al.
patent: 58048682 (1981-09-01), None
patent: 58-48682 (1983-03-01), None
patent: 58-048682 (1983-03-01), None

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