Methods and devices for fabricating and assembling printable...

Details Methods and devices for fabricating and assembling printable... Methods and devices for fabricating and assembling printable...

2005-06-02

2009-11-24

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Gettering of substrate

By vibrating or impacting

C438S106000, C257SE21499, C257SE23065, C257SE23177, C257SE21505, C257SE21567, C257SE21122

Reexamination Certificate

active

07622367

ABSTRACT:
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

REFERENCES:
patent: 4761335 (1988-08-01), Aurichio et al.
patent: 4766670 (1988-08-01), Gazdik et al.
patent: 5545291 (1996-08-01), Smith et al.
patent: 5772905 (1998-06-01), Chou
patent: 5783856 (1998-07-01), Smith et al.
patent: 5817242 (1998-10-01), Biebuyck et al.
patent: 5824186 (1998-10-01), Smith et al.
patent: 5904545 (1999-05-01), Smith et al.
patent: 6225149 (2001-05-01), Gan et al.
patent: 6274508 (2001-08-01), Jacobsen et al.
patent: 6281038 (2001-08-01), Jacobsen et al.
patent: 6291896 (2001-09-01), Smith
patent: 6316278 (2001-11-01), Jacobsen et al.
patent: 6380729 (2002-04-01), Smith
patent: 6403397 (2002-06-01), Katz
patent: 6417025 (2002-07-01), Gengel
patent: 6420266 (2002-07-01), Smith et al.
patent: 6468638 (2002-10-01), Jacobsen et al.
patent: 6479395 (2002-11-01), Smith et al.
patent: 6555408 (2003-04-01), Jacobsen et al.
patent: 6527964 (2003-05-01), Smith et al.
patent: 6566744 (2003-05-01), Gengel
patent: 6580151 (2003-06-01), Vandeputte et al.
patent: 6586338 (2003-07-01), Smith et al.
patent: 6590346 (2003-07-01), Hadley et al.
patent: 6606079 (2003-08-01), Smith
patent: 6606247 (2003-08-01), Credelle et al.
patent: 6608370 (2003-08-01), Chen et al.
patent: 6623579 (2003-09-01), Smith et al.
patent: 6655286 (2003-12-01), Rogers
patent: 6657289 (2003-12-01), Craig et al.
patent: 6665044 (2003-12-01), Jacobsen et al.
patent: 6683663 (2004-01-01), Hadley et al.
patent: 6693384 (2004-02-01), Vicentini et al.
patent: 6723576 (2004-04-01), Nozawa et al.
patent: 6730990 (2004-05-01), Kondo et al.
patent: 6731353 (2004-05-01), Credelle et al.
patent: 6780696 (2004-08-01), Schatz
patent: 6816380 (2004-11-01), Credelle et al.
patent: 6844673 (2005-01-01), Bernkopf
patent: 6848162 (2005-02-01), Arneson et al.
patent: 6850312 (2005-02-01), Jacobsen et al.
patent: 6863219 (2005-03-01), Jacobsen et al.
patent: 6864435 (2005-03-01), Hermanns et al.
patent: 6864570 (2005-03-01), Smith
patent: 6872645 (2005-03-01), Duan et al.
patent: 6878871 (2005-04-01), Scher et al.
patent: 6949206 (2005-09-01), Whiteford
patent: 7169669 (2007-01-01), Blakers et al.
patent: 7195733 (2007-03-01), Rogers et al.
patent: 7255919 (2007-08-01), Sakata et al.
patent: 7374968 (2008-05-01), Kornilovich et al.
patent: 2003/0006527 (2003-01-01), Jacobs et al.
patent: 2003/0178316 (2003-09-01), Jacobs et al.
patent: 2003/0227116 (2003-12-01), Halik et al.
patent: 2004/0005723 (2004-01-01), Empedocles et al.
patent: 2004/0026684 (2004-02-01), Empedocles
patent: 2004/0079464 (2004-04-01), Kumakura
patent: 2004/0095658 (2004-05-01), Buretea et al.
patent: 2004/0112964 (2004-06-01), Empedocles et al.
patent: 2004/0136866 (2004-07-01), Pontis et al.
patent: 2004/0146560 (2004-07-01), Whiteford et al.
patent: 2004/0178390 (2004-09-01), Whiteford
patent: 2004/0192082 (2004-09-01), Wagner et al.
patent: 2004/0206448 (2004-10-01), Dubrow
patent: 2004/0250950 (2004-12-01), Dubrow
patent: 2005/0038498 (2005-02-01), Dubrow et al.
patent: 2005/0238967 (2005-10-01), Rogers et al.
patent: 2006/0038182 (2006-02-01), Rogers et al.
patent: 2006/0134893 (2006-06-01), Savage et al.
patent: 2002092984 (2002-03-01), None
patent: 367570 (1999-08-01), None
patent: 494257 (2002-07-01), None
patent: WO 00/46854 (2000-08-01), None
patent: WO 00/49421 (2000-08-01), None
patent: WO 00/49658 (2000-08-01), None
patent: WO 00/55915 (2000-09-01), None
patent: WO 00/55916 (2000-09-01), None
patent: WO 01/33621 (2001-05-01), None
patent: WO 02/27701 (2002-04-01), None
patent: WO 02/43032 (2002-05-01), None
patent: WO 02/097708 (2002-12-01), None
patent: WO 02/097724 (2002-12-01), None
patent: WO 03/032240 (2003-04-01), None
patent: WO 03/049201 (2003-06-01), None
patent: WO 03/063211 (2003-07-01), None
patent: WO 03/085700 (2003-10-01), None
patent: WO 03/085701 (2003-10-01), None
patent: WO 03/092073 (2003-11-01), None
patent: WO 2004/003535 (2004-01-01), None
patent: WO 2004/022637 (2004-03-01), None
patent: WO 2004/022714 (2004-03-01), None
patent: WO 2004/023527 (2004-03-01), None
patent: WO 2004/024407 (2004-03-01), None
patent: WO 2004/027822 (2004-04-01), None
patent: WO 2004/032190 (2004-04-01), None
patent: WO 2004/032191 (2004-04-01), None
patent: WO 2004/032193 (2004-04-01), None
patent: WO 2004/034025 (2004-04-01), None
patent: WO 2004/086298 (2004-10-01), None
patent: WO 2004/094303 (2004-11-01), None
patent: WO 2004/099068 (2004-11-01), None
patent: WO 2004/100252 (2004-11-01), None
patent: WO 2004/105456 (2004-12-01), None
patent: WO 2005/005679 (2005-01-01), None
patent: WO 2005/015480 (2005-02-01), None
patent: WO 2005/017962 (2005-02-01), None
patent: WO 2005/022120 (2005-03-01), None
Chang et al. (1994) “Process Techniques,” “Lithography,” and “Device-Related Physics and Principles,” In;GaAs High-Speed Devices: Physics, Technology and Circuit Application, John Wiley and Sons, New York, pp. 115-278.
Givargizov, E.I. (1991) “Applications,” In;Oriented Crystallization on Amorphous Substrates, Plenum Press, New York, pp. 341-363.
Allen et al. (Feb. 20, 2006) “Nanomaterial Transfer Using Hot Embossing for Flexible Electronic Devices,”Appl. Phys. Lett.88:083112.
Ambrosy et al. (1996) “Silicon Motherboards for Multichannel Optical Modules,”IEEE Trans. Compon. Pack. A19:34-40.
Aoki et al. (2003) “Microassembly of Semiconductor Three Dimensional Photonic Crystals,”Nat. Mater.2:117-121.
Bachtold et al. (Nov. 9, 2001) “Logic Circuits with Carbon Nanotube Transistors,”Science294:1317-1320.
Balmer et al. (2005) “Diffusion of Alkanethiols in PDMS and Its Implications on Microcontact Printing (μCP),”Langmuir21(2):622-632.
Bao et al. (1997) “High-Performance Plastic Transistors Fabricated by Printing Techniques,”Chem. Mater.9:1299-1301.
Barquins, M. (1992) “Adherence, Friction and Wear of Rubber-Like Materials,”Wear158:87-117.
Bauer et al. (2004) “Biological Applications of High Aspect Ratio Nanoparticles,”J. Mater. Chem.14:517-526.
Bietsch et al. (Oct. 1, 2000) “Conformal Contact and Pattern Stability of Stamps Used for Soft Lithography,”J. Appl. Phys.88(7):4310-4318.
Blanchet et al. (2003) “Printing Techniques for Plastic Electronics,”J. Imag. Sci. Tech.47(4):296-303.
Blazdell et al. (Nov. 1999) “Preparation of Ceramic Inks for Solid Freeforming Using a Continuous Jet Printer,”J. Mat. Syn. Process.7(6):349-356.
Bowden et al. (1997) “Self Assembly of Mesoscale Objects into Ordered Two-Dimensional Arrays,”Science276:233-235.
Braun et al. (1999) “Electrochemically Grown Photonic Crystals,”Nature402:603-604.
Brown, H.R. (1991) “The Adhesion Between Polymers,”Ann. Rev. Mater. Sci.21:463-489.
Buma et al. (2001) “High-Frequency Ultrasound Array Element Using Thermoelastic Expansion in an Elastomeric Film,”Appl. Phys. Lett.79:548-550.
Burdinski et al. (2005) “Single Etch Patterning of Stacked Silver and Molybdenum Alloy Layers on Glass Using Microcontat Wave Printing,”J. Am. Chem. Soc.127(31):10786-10787.
Campbell et al. (2000) “Fabrication of Photonic Crystals for the Visible Spectrum by Holographic Lithography,”Nature404:53-56.
Cao et al. (2006) “Highly Bendable,Transparent Thin-Film Transistors That Use Carbon-Nanotube-Based Conductors and Semiconductors with Elastomeric Delectrics,”Adv. Mater.18(3):304-309.
Chen et al. (2003) “Electronic Paper: Flexible Active-Matrix El

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