Methods and devices for coupling optoelectronic packages

Details Methods and devices for coupling optoelectronic packages Methods and devices for coupling optoelectronic packages

2005-02-01

2005-02-01

Palmer, Phan T. H. (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S065000, C385S083000, C385S092000

Reexamination Certificate

active

06848839

ABSTRACT:
Optoelectronic packages comprise both an optical array and base chip. The array and base chip are aligned and coupled using a combination of V-grooves, wick stops, and alignment spheres (e.g., presion ball bearings). The array and base chip are passively aligned by disposeing an optical fiber having an angled endface onto V-grooves in both the array and base chip. The base chip typically comprises an optical surface device, such as a vertical cavity, surface emitting laser or photodetector.

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