Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2005-03-22
2005-03-22
Hail, III, Joseph J. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S028000, C451S036000, C451S057000, C451S921000, C051S306000, C252S079100, C252S079200, C438S692000, C156S922000
Reexamination Certificate
active
06869336
ABSTRACT:
Methods and compositions are provided for the chemical mechanical planarization of ruthenium. The method includes polishing the ruthenium layer using a low contact pressure and exposing the ruthenium layer to a planarization composition while polishing. The planarization composition comprises a dispersing medium and a plurality of abrasive particles. The method further includes removing the ruthenium of the ruthenium layer as a ruthenium hydroxide if the pH of the composition is in the range of from about 8 to about 12. The planarization composition may further comprise an oxidizing agent, with the ruthenium removed as a ruthenium hydroxide if the pH of the composition is in the range of from about 2 to about 14. The planarization composition may further comprise a complexing agent, with the ruthenium transformed into an ionic state and removed as a ruthenium complex if the pH of the composition is no greater than about 2.5.
REFERENCES:
patent: 5527423 (1996-06-01), Neville et al.
patent: 5691219 (1997-11-01), Kawakubo et al.
patent: 5693239 (1997-12-01), Wang et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 6126853 (2000-10-01), Kaufman et al.
patent: 6146244 (2000-11-01), Atsugi et al.
patent: 6293848 (2001-09-01), Fang et al.
patent: 6527622 (2003-03-01), Brusic et al.
patent: 20030139116 (2003-07-01), Moegganborg et al.
Kevin Moeggenborg, et al., “Development of Planarization Process for Nontraditional Materials: Noble Metals CMP”, CMP-MIC Conference, Mar. 7-8, 2001, pp. 150-156.
Oliver Chyan, et al., “Ruthenium-based Copper Diffusion Barrier: Studied by Electrochemistry, SIMS Depth Profiling and Sheet Resistance Measurements”, The Electrochemical Society, Inc. 2003.
Oliver Chyan, et al., “Electrodeposition of Copper Thin Film on Ruthenium, A Potential Diffusion Barrier for Cu Interconnects”, Journal of the Electrochemical Society, vol. 150, No. 5 (2003).
Hail III Joseph J.
Ingrassia Fisher & Lorenz PC
Novellus Systems Inc.
Ojini Anthony
LandOfFree
Methods and compositions for chemical mechanical... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and compositions for chemical mechanical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and compositions for chemical mechanical... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3423827