Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-07-19
2005-07-19
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S118000
Reexamination Certificate
active
06919225
ABSTRACT:
An apparatus and methods of making an electronic assembly. The electronic assembly comprises a functional block having at least one asymmetric feature. The functional block comprises an integrated circuitry to perform a function pertaining to the electronic assembly. The electronic assembly further comprises a substrate having a receptor site to mate with the functional block using a fluidic self-assembly process.
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patent: 4975143 (1990-12-01), Drake et al.
patent: 5545291 (1996-08-01), Smith et al.
patent: 5757199 (1998-05-01), Maruyama
patent: 6291896 (2001-09-01), Smith
Craig Gordon S. W.
Snyder Eric Jonathan
Tu Jay Kuang-Jieh
Alien Technology Corporation
Blakely , Sokoloff, Taylor & Zafman LLP
Tsai H. Jey
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